Products P/N：DF12C(3.0)-50DS-0.5V
Manufacturer： HIROSE
Features:
0.5mm pitch models with the board-to-board stacking height of 3mm, 3.5mm, 4mm, and 5mm are provided.
For the protection of the solder joints from peeling off due to mechanical stress, products with metal holddowns are available.
Specifications with a guide post for manual work and those with no guide post for automatic mounting are available.
Applications:
Mobile phones, LCD, MO, Notebook PC, Portable terminals (PDA), Digital video cameras (DVC), Digital cameras (DSC), Car audio, Car navigation, Set top box, CMOS camera module, Sensors, Bluetooth
Characteristic:
Current Rating(Amps)(Max.) : 0.3
PCB Mount Type : SMT
Contact Mating Area Plating : Gold
Terminal Pitch (mm) : 0.5
Contact Spacing (mm) : 0.5
Stack Height (mm) : 4.5
Operating Temperature Range (degrees C) : -45℃~ +125℃
FPC Thickness (mm) : 0.18, 0.3
Connector Type : Board mounting
Contact Gender : Female , Male
Suitable for Module:
MC55、MC56
